- FEI Sells Knights Technology to Magma Design Automation
Magma Design Automation Inc. (Nasdaq: LAVA), a provider of chip design solutions, announced it has acquired Knights Technology, a provider of yield management and failure analysis software solutions to the semiconductor industry, from FEI Company (Nasdaq: FEIC). Knights Technology products, employees and management team will be part of Magma’s Fab Analysis Business Unit.
- Samsung Creates Industry’s Thinnest Mobile LCD Screen
Samsung Electronics Co., Ltd., the world’s largest provider of thin-film transistor, liquid crystal display (TFT-LCD) panels announced that it has developed the thinnest reported LCD panel, one no thicker than a credit card at 0.82mm, which is 0.07mm thinner than the panel previously reported to be the world’s slimmest. The company also announced that it has developed a new mobile technology, which it is calling “i-Lens,” for integrating the entire panel assembly, including a protective layer, into a single, thinner module that is more shock-resistant and easier to read than conventional panels.
- Sybase Acquires Embedded Software Licensing, Services of iFoundry
Sybase, Inc. (NYSE: SY), a leading provider of enterprise infrastructure and mobile software, announced that it has acquired certain assets from Singapore-based iFoundry Systems, a privately held engineering services company focused on designing, developing and building wireless mobility solutions, in an all-cash transaction. The transaction is not expected to have a material impact on 2006 consolidated results.
- NXP, Sony to Develop Secure Chips for Contactless Mobile Transactions
NXP Semiconductors, formerly Philips Semiconductors, and Sony Corporation have signed a memorandum of understanding (MOU) to establish by mid-year 2007 a joint venture (JV) that will drive global adoption of contactless smart card applications in mobile phones. The anticipated JV will plan, develop, produce and market a secure chip that will include both MIFARE(R) and FeliCa(TM) operating systems and applications, as well as other contactless card operating systems and applications.
- Altera, WEDC Target Military-Aerospace with FPGA Packaging Options
Altera Corporation (NASDAQ: ALTR) and White Electronic Designs Corporation (NASDAQ: WEDC) announced a partnership that will enable military and aerospace customers access to a broad variety of packaging options for FPGAs that meet the rigorous requirements of defense applications. This is the first cooperative packaging agreement of its kind in the programmable logic industry.
- Freescale Selects Synopsys EDA Tools for Functional Verification
Freescale Semiconductor, Inc. (NYSE: FSL) (NYSE: FSL.B), a global leader in the design and manufacture of embedded semiconductors for wireless, networking, automotive, consumer and industrial markets and Synopsys, Inc. (Nasdaq:SNPS), a world leader in semiconductor design software, announced that they have signed an agreement for Freescale’s use of Synopsys electronic design automation software for the functional verification of complex semiconductor designs. Freescale currently deploys Synopsys’ Discovery(TM) Verification Platform for SystemVerilog-based verification, including the VCS(R) functional verification solution with Native Testbench (NTB) technology.
- Synopsys Enables Wolfson to Meet Tight Area, Power, Performance Goals
Synopsys, Inc. (Nasdaq:SNPS), a world leader in semiconductor design software, announced that Wolfson Microelectronics plc, a global leader in high-performance mixed-signal chips for the digital market, has selected Synopsys’ Galaxy(TM) Design and Discovery(TM) Verification Platforms, as well as Synopsys’ DesignWare(R) Library intellectual property (IP), for the design and verification of Wolfson’s high-performance analog mixed-signal (AMS) integrated circuits (ICs).