EDA Blog - electronic design automation, embedded systems, ic

EDA News - 2006.11.10

• TI Creates Industry's Highest Performance Combo Sample Rate Converter
  Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced the industry's highest performance, combo sample rate converter (SRC) from the company's Burr-Brown pro audio product line. The SRC4392 integrates a two-channel asynchronous SRC with a digital audio interface receiver (DIR) and transmitter (DIT). Featuring 144dB dynamic range, -140dB distortion and up to 216kHz sampling rates, the device is used in a variety of professional and broadcast audio applications, such as digital mixing consoles, digital audio workstations, audio distribution and broadcast studio equipment.
• Excel Software Introduces RbApp 2.0 for REALbasic Developers
  Excel Software is pleased to announce RbApp 2.0 for REALbasic developers. RbApp is a collection of reusable classes for writing Macintosh and Windows software with the REALbasic programming language from REAL Software. Version 2.0 adds the new RbGrid, RbChart and RbQuickLicense components plus enhancements to the current RbEdit, RbView, RbCommand, RbPalette, RbStringList, RbXML, RbHelp and RbLibrary. It supports the latest REALbasic 2006R4 for Universal Binaries.
• Sequence Design to Moderate EDAC Panel on Doing Business in India
  Sequence Design president and CEO Vic Kulkarni is set to moderate an EDAC panel Tuesday, Nov. 28 on "Doing Business in India." Industry leaders from EDA and venture capital will take on multiple topics, including how to sell in the Indian market, technology offshoring, where to set up operations, and how to leverage financial and tax benefits in the world's fourth-largest economy.



• Wyse Technology Previews Windows CE 6.0 for Thin Clients
  Wyse Technology, the global leader in thin computing, announce a preview of Windows Embedded CE 6.0 for Wyse thin computers. This preview demonstrates Windows Embedded CE 6.0 running in thin computing environments optimized for security, manageability and ease of deployment.
• Aeroflex Debuts GAN, GSM/EGPRS Mobile Terminal Protocol Test Solution
  Aeroflex has announced a single system, turnkey solution for testing 3GPP compliant networks supporting both GAN (Generic Access Network) over 802.11 WLAN and GSM/EGPRS with the addition of an integrated GAN capability to its highly successful 6103 AIME and 6103 AIME/CT mobile terminal protocol test systems.
• Cadence, SMIC Address Wireless Design Challenges in China
  Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, and Semiconductor Manufacturing International Corporation (SMIC) (NYSE: SMI; SEHK: 0981.HK) today announced a new collaboration to deliver the Cadence(R) RF (Radio-Frequency) Design Methodology Kit to the China RF IC design market. SMIC will develop process-design kits (PDKs) that will support the Cadence RF Design Methodology Kit and will validate the PDKs in a test chip by the end of 2006.
• Adeneo Wins Third eMVP Award for Windows CE Expertise
  MICROSOFT MVP (Most Valuable Professionals) are recognized people, specialized in windows embedded products, who are actively involved in on line and off line communities to provide their competences to other MICROSOFT users. By this way, MICROSOFT keeps up-to-date with users' wishes.
• Intel Honors Kontron with Partner of the Year Award
  At the 2006 Intel(R) Communications Alliance Congress in Arizona, USA, Kontron AG was honored as the ICA Partner of the Year 2006. The Intel Communications Alliance is Intel's partner program for embedded computer manufacturers, in particular in the telecommunications sector. Worldwide, the alliance has more than 200 members, four of them holding premiere status (Kontron, Hewlett Packard, Motorola and Radisys).

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