- TI Makes Multimedia Cell Phones Affordable for Mass Market
During a summit of wireless industry leaders held today in Beijing, China, Texas Instruments Incorporated (NYSE: TXN) (TI) announced a new OMAP-Vox(TM) single-chip solution to foster development of lower-cost multimedia-rich feature phones. Codenamed “eCosto,” the new single-chip platform is leveraging TI’s innovative DRP(TM) technology which is successful with the “LoCosto” value platform in volume production today.
- TI Makes Wireless Connection in Rural Areas of China
Rich Templeton, President and Chief Executive Officer of Texas Instruments Incorporated (NYSE: TXN) (TI), today told an audience of handset manufacturers and mobile service operators that “all of us have an important role to play” in helping China connect more people in its rural areas and across the country.
- TI Boosts Development of Affordable Multimedia Feature Phones
Furthering its commitment to accelerate wireless growth in China and high-growth markets worldwide, Texas Instruments Incorporated (TI) [NYSE:TXN] is working with leading application software providers to offer a scalable, integrated application suite to boost development of affordable multimedia feature phones.
- EEMBC Publishes Scores for NXP’s ARM7-based LPC2129 Microcontroller
New certified processor benchmark scores published today by the Embedded Microprocessor Benchmark Consortium (EEMBC(R)) for the NXP Semiconductors(TM) ARM7-based LPC2129 microcontroller provide a striking indication of the impact of embedded high-speed flash memory design on device performance and the differences among ARM7-based devices from various suppliers.
- Microchip Ships Over Five Billion PIC Microcontrollers
Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller and analog semiconductors, today announced the shipment of its five billionth PIC(R) microcontroller to Chinese power-meter maker Jiangsu Linyang Electronics. Microchip delivered its five billionth microcontroller, the PIC18LF8720-I/PT, barely a year after delivering its four billionth in September 2005.
- Northrop Grumman Acquires Essex
Northrop Grumman Corporation (NYSE: NOC – News) announced today that it has signed a definitive agreement under which Northrop Grumman will acquire for cash all of the outstanding shares of Essex Corporation (Nasdaq: KEYW – News) for $24 per common share. The transaction is valued at approximately $580 million, which includes the assumption of Essex’s debt.
- Intellon and Texas Instruments Make Triple Play at Home
Texas Instruments Incorporated (NYSE: TXN) (TI), the leading provider of digital signal processing solutions, and Intellon Corporation, the leading provider of HomePlug(R) powerline communications ICs for home networking, today announced a collaboration to jointly develop and market residential gateway (RG) reference designs to accelerate delivery of data, voice and multimedia content throughout the home. The relationship is expected to result in comprehensive RG solutions that allow service providers to offer consumers high definition IPTV and triple play services over existing electrical wires.
- UMC Rolls Out Largest 65nm FPGAs to Xilinx
UMC (NYSE:UMC) (TSE:2303), a leading global semiconductor foundry, announced that it has delivered the world’s largest 65nm FPGAs to Xilinx. The new devices deliver a 65 percent logic capacity increase over previous generation FPGAs to enable the industry’s highest gate count, with approximately 1.1 billion transistors. The chips, which feature triple gate oxide technology and 11 copper metal layers, have demonstrated excellent initial yields and are expected to be ready for full production in several months.
- SiliconIndia Selects Sequence Design for Top si100 List
Sequence Design, the EDA leader in power-aware SoC design solutions, today announced it has earned a coveted spot on SiliconIndia’s annual si100 list for the second year in a row. Honoring the top U.S. companies founded and managed by Indians, the si100 award goes to those companies best exemplifying entrepreneurship, innovation, and market leadership.