EDA News – 2006.10.20

  • Caltech Licenses Thin-Film Thermoelectric Technology to Nextreme Thermal
    Nextreme Thermal Solutions, a pioneer in solid-state thermal management in electronics and semiconductors, today announced that it has signed an exclusive option to license new, thin-film thermoelectric technology from the California Institute of Technology (Caltech). The technology covers pioneering work on thin-film thermoelectric devices carried out at NASA’s Jet Propulsion Laboratory (JPL), an operating division of Caltech. The addition of this pioneering technology to Nextreme’s intellectual property portfolio complements technology previously acquired from RTI International in 2004 and significantly strengthens the company’s IP portfolio as a leading developer of embedded thermoelectric cooling solutions.
  • NA Semiconductor Equipment Industry Posts Book-to-Bill Ratio of 1.00
    North American-based manufacturers of semiconductor equipment posted $1.62 billion in orders in September 2006 (three-month average basis) and a book-to-bill ratio of 1.00 according to the September 2006 Book-to-Bill Report published today by SEMI. A book-to-bill of 1.00 means that $100 worth of orders were received for every $100 of product billed for the month.
  • ABI Research Expects Femtocell Shipments to Reach 19 Million in 2011
    By 2011 the worldwide market for femtocell products is expected to reach nearly 19 million units per annum. An interesting factor that is often overlooked when considering the femtocell market is that of functionality. Initial offerings are likely to be simple affairs that rely on Ethernet connections to existing ADSL gateways.
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  • Xilinx Showcases Radio Modem, Cryptography Power Solutions at Milcom
    Xilinx, Inc. (NASDAQ: XLNX), the world’s leading PLD provider today announced that it will showcase modem and crypto solutions designed to reduce the size, weight and power of military radios at the Military Communications (MILCOM) 2006 conference, October 23 -25, 2006 in Washington, D.C.