- ZiLOG Releases ZLR64400 Microcontrollers with On-Chip Learning
In a development that further reinforces its position as the leading supplier of microcontroller (MCU) solutions for the universal infrared (UIR) remote control market, ZiLOG(R) Inc. (Nasdaq: ZILG) today announced the release of the ZLR64400 family of 8-bit MCU devices, the latest addition to its Crimzon(TM) line of infrared-specific silicon. In common with ZLP12840 OTP (One Time Programmable device), launched in November 2005, the ZLR64400 features an “on-chip” ability to learn codes from other infrared remote controls for consumer products via a learning circuit.
- IMEC Validates Flexible Air Interface for Nomadic Terminals
IMEC has validated the hardware implementation of its software-defined radio digital baseband – called flexible air interface – for nomadic terminals, achieving power consumption comparable with dedicated solutions. The cost- and power-efficient architecture supports all radio standards from next generation cellular (3GPP-LTE) to high data rate WLAN-WiMAX-DVB (OFDM-MIMO-based).
- IMEC Combines Multi-Disciplinary Research
IMEC announces that it will give momentum to its ‘More than Moore’ research, building on its 130nm CMOS base process and expertise in heterogeneous technologies. Using its existing 200mm infrastructure, IMEC will offer CMOS-based process R&D combined with additional process modules and devices and application-specific demonstrators for ‘More than Moore’ processes and systems.
- IMEC Demonstrates Double Patterning Immersion Litho for 32nm Node
IMEC showed in collaboration with ASML the potential of double patterning 193nm immersion lithography at 1.2NA for 32nm node Flash and logic. These results prove that double patterning might be an intermediate solution before extreme ultraviolet (EUV) lithography and very high NA (beyond water) 193nm immersion lithography will be ready for production. Meanwhile, installation of both ASML’s XT:1700i immersion scanner and EUV alpha demo tool (ADT) runs at full speed in IMEC’s 300mm clean room.
- IMEC, NSC Develop Copper-Top (Cu-top) Interconnect Technology
IMEC successfully transferred its Copper-Top (Cu-top) interconnect process technology to National Semiconductor’s production facility in Malacca Malaysia. The Cu-top technology is a low resistance, post-passivation interconnect module particularly suited for analog and mixed-signal applications. It improves system-efficiency and results in a significant chip-size reduction of such semiconductor devices.
- Redback Verifies Network Processor with Cadence Xtreme III System
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, today announced that Redback Networks Inc., a leader in next-generation broadband networks, has selected the Cadence(R) Incisive(R) Design Team Xtreme III acceleration and emulation solution. The new Xtreme III System is capable of verifying 72-millon-gate designs and delivers performance gains in the range of 10 to100,000 times compared to simulation. The system is designed to improve overall verification throughput and quality of Redback’s next-generation flagship network processor.
- Mentor Graphics LeonardoSpectrum Supports Xilinx Virtex-5 LXT FPGAs
Mentor Graphics(R) Corporation (NASDAQ: MENT) today announced that its suite of advanced synthesis products supports the newly introduced Virtex(TM)-5 LXT field programmable gate arrays (FPGAs) from Xilinx, Inc. (NASDAQ: XLNX). Synthesis support for Virtex-5 LXT FPGAs is available now in Precision(R) Synthesis, release 2006a. Support within the LeonardoSpectrum(TM) tool suite will follow.
- Lingoport Globalyzer 2.3 Improves Globalization of Software
Lingoport, Inc., a leading developer of globalization software and services, today announced its release of Globalyzer(TM) 2.3 to help companies make their software ready to meet the demands of world market customers. Globalyzer 2.3 enhancements further enable a company’s software to support worldwide language, locale and cultural formatting requirements so the software will perform gracefully in any target market.
- Acrosser Rolls Out AR-B1652 Fanless 3.5-inch SBC with VIA Mark Processor
Acrosser Technology, Co., LTD today announces the availability of AR-B1652, the 3.5″ SBC built with power-efficient VIA Mark Corefusion Processor and VT82C686B chipset feature low power consumption and fanless operation. Integrating with VIA S3 ProSavage 4 Graphics core, AR-B1652 supports dual independent display, LVDS/TTL LCD interfaces and VGA display resolution of up to 1600 x 1200 pixels.
- Strategic Test Creates Smallest Monahans P System on Module (SOM)
Strategic Test has announced the World’s smallest Intel/Marvel ‘Monahans P’ System on Module (SOM). Called the TRITON-290, it measures just 67.6 x 26 x 4.2 mm (2.6″ x 1″ x 0.16″) and contains an 806 MHz PXA290 processor coupled with 64 MB SDRAM and 128 MB Flash. The module uses a 200 pin SODIMM connector and as standard has an extended temperature range of –25 degC to +85 degC. First shipments are slated to start in November, together with a complete Development Kit running Linux 2.6.17 and Microsoft Windows CE 5.0.