- Agilent Acquires Remcom’s 3D Electro-Magnetic Antenna Simulation Technology
Agilent Technologies Inc. (NYSE:A) and privately held Remcom Inc. today announced that Agilent has licensed 3D Electro-Magnetic (EM) simulation technology from Remcom, a proven provider of time-domain 3D EM technology. Financial details were not disclosed. Remcom will continue to develop, sell and support XFDTD, which is based on this technology.
- Microchip Enables 1.5A Low Dropout Regulators Smaller Designs
Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, today announced the MCP1827 and MCP1827S low output voltage, high output current Low Dropout Regulators (LDOs). The new LDOs are available in small, thermally efficient 3- and 5-pin packages, and support output currents up to 1.5A. They are well positioned to power smaller-geometry-based embedded processors/controllers and next-generation logic cores, such as those found in computer, industrial and power-supply applications.
- Strategic Test Debuts 8 Channel 3 MS/s 16-bit A/D Digitizer Cards
Strategic Test Corp has released twelve new Digitizer cards in the UF2-4600 series. Using multiple 16-bit ADC’s for true simultaneous sampling, the cards are available with a choice of maximum sampling rates from 200 kS/s to 3 MS/s and 2, 4 or 8 channel configurations – enabling the user to select the most cost-effective solution. 32 MSamples of signal memory is provided as standard, but can be expanded to 2 GSamples through a proprietary DIMM module onboard. As with all UltraFast cards the signals can be recorded to card memory and then offloaded, or continuously streamed at up to 225 MBytes per second to the PC host.
- TI Unveils Gigabit Ethernet IP Phone Software and Silicon Solution
Texas Instruments (TI) today announced a full-featured Gigabit Ethernet IP phone software and silicon solution that incorporates robust security and enhanced voice quality features to meet the needs of small, medium and large business Voice over IP (VoIP) users. TI’s newest IP phone System-on-a-Chip (SoC) is designed on a flexible and powerful digital signal processing (DSP) platform that reduces development costs and helps speed manufacturers’ time to market in developing new IP phone products that will increase productivity as well as lower their cost of communications.
- NEC Creates First Ultra-Low-Power 55nm Embedded DRAM Technology
NEC Electronics and its subsidiaries in North America and Europe, NEC Electronics America, Inc. and NEC Electronics (Europe) GmbH, today announced the industry’s first 55- nanometer (nm) CMOS-compatible embedded DRAM (eDRAM) technology, UX7LSeD. An enhancement to NEC Electronics’ patented metal-insulator-metal (MIM2) technology, the new eDRAM process is the industry’s first combination of hafnium silicate film and nickel silicide, which has resulted in reduced power consumption and leakage current at this advanced node. Optimized for high-speed, low-power operation, the new process can be applied to system-on-chip (SOC) devices designed for a broad range of products — from mobile equipment such as cell phones and mobile handheld devices to digital consumer devices such as gaming consoles.
- Momentum Leads Mercury to SBC with 2 Dual-Core Intel Xeon Processors ULV
Mercury Computer Systems, Inc. (NASDAQ: MRCY) today announced a new family of single-board computers (SBCs) that use two Dual-Core Intel(R) Xeon(R) processors ULV on a 6U single-slot module. Symmetric multiprocessing, or SMP, enables any processor to work on any task, and SMP systems can easily move tasks between processors to efficiently balance the processing workload.
- Verizon Certifies Digi High Speed Wireless WAN Router for EV-DO Network
Digi International (NASDAQ: DGII) today announced that its ConnectPort WAN VPN is now certified by Verizon Wireless for use on its high speed EV-DO network. The ConnectPort WAN VPN is the first commercial grade, upgradeable, 3G wireless wide area network (WWAN) router that provides a secure, high-speed WWAN connection for reliable primary and backup network connectivity to remote sites and devices. Because the solution is modular, it is upgradeable, making it easier for customers to quickly migrate to future advanced platforms as networks evolve.
- AXIOMTEK TFT Panel Computers Support SAW Touch Screens for KIOSK
AXIOMTEK, as a trusted Applied Computing Platform provider, has designed a series of KIOSK panel computers for customers’ multiple application alternatives. We are proud to launch two new KIOSK panel computers, the PANEL1155-807 and PANEL5155-807, both equipped with high brightness 15-inch XGA TFT LCD displays. The PANEL1155-807 and PANEL5155-807 support the most popular SAW (Surface Acoustic Wave) touch screens and high performance processors including Intel(R) Pentium(R) M and Intel(R) Celeron(R) M CPUs. The PANEL1155-807 is outfitted with an up-to-date front bezel and the PANEL5155-807 gives customers a flexible open frame pick. These two panel computers are most favorable for the KIOSK fields and public information solutions.
- Amkor Standardizes on Cadence System-in-Package (SiP) Design Products
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, today announced that Amkor Technology, Inc., a leading provider of advanced semiconductor assembly and test services, has standardized on the new Cadence(R) System-in-Package (SiP) design products and methodologies for use in their worldwide design centers.
- Cadence Introduces Incisive Design Team Xtreme III Systems
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, today announced the introduction of Cadence(R) Incisive(R) Design Team Xtreme III Systems, the next generation of the Incisive Xtreme series of accelerator/emulators within the Incisive functional verification platform. Developed with the design engineer in mind, Xtreme III Systems combine the power and speed of hardware assisted verification with ease of use for simulation savvy designers.