EDA News – 2006.08.17

  • CalAmp Receives Patent for Smart Antenna
    CalAmp, a leading provider of wireless products and engineering services, today announced that the U.S. Patent and Trademark Office has awarded CalAmp a new U.S. Patent titled “Wireless communications structures and methods utilizing frequency domain spatial processing” (Number 7,072,693). The patent outlines a system and method for wireless transceivers that receive and transmit signals from an array of antennas that are connected to spatial processing channels. The patent’s claims cover a system to enhance the overall performance of a wireless broadband network in the presence of multipath interference.
  • Marvell Creates Single Chip WLAN Plus Bluetooth Solution
    Marvell(R), the leader in storage, communications, and consumer silicon solutions, today announced the world’s first 90-nm CMOS, WLAN plus Bluetooth single chip solution for cellular handsets, battery-powered media players, portable gaming consoles, smartphones, PDAs and ultra-low-power computing platforms. Expanding on the Company’s growing success in offering low-power, small footprint WLAN solutions to the consumer market, Marvell leads the industry with the first WLAN plus Bluetooth solution that offers leading edge integration, extensive host offload capability and advanced co-existence and power save modes — with a footprint of less than 80 mm3. The Marvell 88W8688 will dramatically extend the battery life of consumer electronics devices, enabling a new level of mobile consumer broadband experience.
  • Kontron ETX miniBaseboard for ETX 3.0-compliant Designs
    Kontron introduces the ETX(R) miniBaseboard, an extremely compact ETX baseboard for ETX 3.0-compliant designs, with a mere 130 mm x 155 mm footprint. It serves as a universal development platform for ETX 3.0 modules and is completely backward compatible with its ETX predecessors. All of the state-of-the-art interfaces are dedicated, which accelerates application testing on this target platform with freely scalable processor performance and so saves time and expense. OEM customers also can use the Kontron ETX miniBaseboard as a standard product for their end applications. As with all of Kontron’s ETX products, OEM customers benefit from long-term availability, robust construction, function-tested design, and are highly future-proof – all thanks to ETX 3.0 compliance.
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  • Made in Japan Software Consortium Sets Standards
    The MIJS ‘Made in Japan Software’ Consortium, consisting of 13 leading domestic software vendors and represented by founding companies Cybozu, Inc. and Softbrain Co., Ltd., was initiated at a public cermony in Tokyo on August 7, 2006. MIJS member companies have organized to standardize the interface between products in each software genre, leading to a future SOA-based service model common to any industry or business category, on a platform adopted by the consortium.
  • Future of WiMAX and Wireless Broadband at WiMAX World
    Trendsmedia today announced a top line-up of high-level executives from wireless carriers, technology companies, content providers and mobile device manufacturers who will share their expertise and vision in addressing the future of WiMAX and mobile wireless broadband at WiMAX World Conference & Expo. The event will be held October 10 – 12, 2006 at the Boston Seaport Hotel and World Trade Center, Boston MA.
  • Sarantel, u-blox Introduces Smart GPS Antenna Reference Design
    Sarantel, the leading manufacturer of revolutionary filtering antennas for mobile and wireless devices, and u-blox AG, the leading Swiss provider of innovative GPS receiver technology, today announce the availability of a new “Smart Antenna” reference design that will shorten time-to-market and reduce the risk of GPS integration for products ranging from personal navigators to multimedia players with built-in navigation functions.
  • Gold vs Copper in Packaging
    Over on the SemiSerious blog: “No doubt, there are many good engineers out there who could overcome the shortcomings of copper as a wirebond material. Ironically, it is probably cost-effectiveness that will stop it. Gold is more expensive, but it benefits from a 40+ year history on the job. It would take an unprecedented level of extremely costly retooling to get copper into the mainstream. It is hard to imagine even a copper wirebond tool maker getting a machine into production, let alone widespread adoption by assembly houses. Gold will not be displaced by copper, at least not for wires. What will change in the industry is the decision point for moving a design from wirebond to flipchip.”