- SEMI Reports Q2 2006 Semiconductor Equipment Billings of $9.59 Billion
SEMI reported that worldwide semiconductor manufacturing equipment billings reached $9.59 billion in the second quarter of 2006. The billings figure is 0.2 percent higher than the first quarter of 2006 and about twenty-seven percent above the same quarter a year ago. The data is gathered in cooperation with the Semiconductor Equipment Association of Japan (SEAJ) from more than 150 global equipment companies that provide data on a monthly basis.
- Dolby Laboratories Teams with MIPS Technologies
MIPS Technologies and Dolby Laboratories announced that the companies will deliver next-generation audio technology across all segments of home entertainment, including the set-top box, HD DVD, and Blu-ray Disc(TM) markets. MIPS Technologies is the first processor IP company to support the new Dolby(R) Digital Plus technology. The newly optimized codec from Dolby Laboratories has been approved for use with all MIPS32(R) processor cores.
- Consumer Electronics Industry to Reach $140 Billion in 2006
The Consumer Electronics Association (CEA(R)) forecasts total CE factory-to-dealer sales to reach $140 billion in 2006, an eight percent growth over 2005, as shown in figures released by CEA in its semi-annual U.S. Consumer Electronics Sales and Forecasts Report. According to CEA Market Research, final year-end totals reached $128 billion in 2005, making 11 percent growth over 2004.
- Alcoa AFL Automotive, Maxwell to Develop Cold Start System
Alcoa AFL Automotive and Maxwell Technologies announced today that they have signed a memorandum of understanding to collaborate on the development of a cold start system for the commercial transportation market. The companies will incorporate Maxwell’s BOOSTCAP(R) ultracapacitors with AFL’s power management system to develop an efficient engine starting system.
- Tundra Rolls Out Tsi350 32-bit PCI-to-PCI Bridge
Tundra Semiconductor, the leader in System Interconnect, announced availability of the Tundra Tsi350, a 32bit PCI-to-PCI Bridge. The Tsi350 is an industry standard, low power 32bit 66MHz asynchronous PCI-to-PCI bridge that is competitively priced and targets new designs or existing board footprints using standard 32bit 66MHz PCI-to-PCI bridges. Fully compliant with PCI Local Bus Specification Revision 2.3, the device has sufficient clock and arbitration pins to directly support nine PCI bus master devices for a wide range of applications including communications and networking equipment, multi-function printers, imaging systems and embedded video recorders.
- MnD Launches Silver Screen Chips for HD Video Mobile Phones
French fabless semiconductor startup, MnD Semiconductors, has developed a chip architecture that can be easily scaled from low cost, high definition, video decoders to high performance, real time, multi-channel, video encoders and transcoders. Called Silver Screen(TM), it will be launched at the IBC2006 show in Amsterdam from 8-12 September on Stand 7.925.
- Console Application for Windows XP Embedded
Over on the Windows XP Embedded Team blog: “I’ve been waiting for months now to talk about this tool publicly, so now that we’ve released FP2007 CTP, I finally can. Those of you who have tried to work with CMI Explorer, the value-add command-line tool we shipped with XPe SP1, will be really happy once you finish reading this article. In Feature Pack 2007, we’re shipping a new version of CMI Explorer, renamed ‘Console Application for Windows XP Embedded’, or XPeCon for short.”
- Structured ASICs in Tandem with FPGAs
Automotive DesignLine: “Developing with a structured ASIC is not without risk. Errors in the logic design can still exist. One way to avoid silicon respins is to use FPGA prototyping and then convert the design from an FPGA to an ASIC. FPGA prototyping is more successful for structured ASICs compared with standard-cell ASICs when the structured ASIC mirrors the resources available on the FPGA.”
- PCB Designers Concern About Meeting Budget
Embedded.com: “With printed-circuit board designs getting faster and more complicated, designers are starting to fret about signal integrity, thermal issues and electromagnetic interference (EMI). But respondents to the pc-board portion of the ‘EE Times 2006 EDA Users Survey’ said that meeting cost budgets is their greatest concern.”